The global political and economic landscape is characterized by volatility; nevertheless, sources within the semiconductor ...

TL;DR: NVIDIA is shifting from CoWoS-S to CoWoS-L advanced packaging for its Blackwell AI GPUs, requiring increased capacity from TSMC, the leader in semiconductor technology. This transition aims ...

TSMC has maintained its equipment orders, despite market rumors regarding a decrease in demand for Chip-on-Wafer-on-Substrate (CoWoS) packaging from Nvidia. According to sources at semiconductor ...

will transition from CowoS-S to CoWoS-L advanced packaging technology. That also shows how TSMC’s advanced packaging technology—chip on wafer on substrate (CoWoS)—is evolving to overcome interconnect ...

TSMC's CoWoS capacity expansion is expected to double again in 2025; commentary on plant progress would be a key focus point in Q4 FY24's earnings call. The next couple of quarters may see further ...

CoWoS stands for chip wafer on a substrate. The CoWos-S is designed to meet the rigorous requirements of artificial intelligence chips. TSMC produces these for Nvidia and AMD (AMD). However ...

Nvidia is transitioning from CoWoS-S to CoWoS-L, representing a significant advancement in its chip architecture as well as a major shift for TSMC. Speaking on the sidelines of an event hosted by ...

Nvidia's high-priority Blackwell GPU models use TSMC's more advanced CoWoS-L technology. The discontinued B200A and the single-die B300 GPUs both use CoWoS-S. Due to these changes, certain ...

CoWoS-S, to combine its AI chips. Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said ...