"Chiplet stacking is a key technology for improving chip performance and cost-effectiveness. In response to the strong market demand for 3D IC, TSMC has completed early deployment of advanced ...

The company also announced an even more ambitious technology named System-on-Wafer (SoW) that will allow for 3D stacking of logic and memory directly on top of a 300mm wafer-sized chip.

Hsinchu, Taiwan – May 24, 2021 – Global Unichip Corp. (GUC), the Advanced ASIC Leader, announces GLink-3D die-on-die interface IP using TSMC's N5 and N6 processes and 3DFabric™ advanced packaging ...

with leaks that the desktop Zen 6 CCD is made on the same TSMC N3E process, with the IOD made on N4C. On the APU side of things, AMD's next-generation Halo APU will stack 3D to improve performance ...