Design-Reuse1y
TSMC Announces the Opening of Advanced Backend Fab 6, Marking a Milestone in the Expansion of 3DFabric™ System Integration Technology
"Chiplet stacking is a key technology for improving chip performance and cost-effectiveness. In response to the strong market demand for 3D IC, TSMC has completed early deployment of advanced ...
Design-Reuse3y
GUC Announces GLink-3D Die-on-Die Interface IP using TSMC N5 and N6 Process for 3DFabric Advanced Packaging Technology
Hsinchu, Taiwan – May 24, 2021 – Global Unichip Corp. (GUC), the Advanced ASIC Leader, announces GLink-3D die-on-die interface IP using TSMC's N5 and N6 processes and 3DFabric™ advanced packaging ...