Democracy will die ‘at the hands of Silicon Valley’ if AI is not properly regulated, ministers warn
Democracy will die “at the hands of Silicon Valley” if artificial intelligence is not properly regulated, a peer has warned ...
Electronic Design12d
Broadcom Bets on 3.5D Packaging Technology to Build Bigger AI Chips
The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.
Semiconductor Engineering1h
Blog Review: Jan. 29
SEMI’s Ana Bernardo reports on key discussions at the recent MEMS & Imaging Sensors Summit 2024, including implications for ...
Semiconductor Engineering2d
Assembly Design Rules Slowly Emerge
Assembly design kits will greatly increase efficiency, but custom methods prevail for now. Process design kits (PDKs) play an ...
tom's Hardware on MSN13d
Nvidia reportedly prioritizing dual-die Blackwell GPUs with CoWoS-L packaging
Nvidia's new Blackwell roadmap for 2025 prioritizes multi-die variants with CoWoS-L packaging, impacting CoWoS-S suppliers.
eeworldonline1d
How to minimize design cycles for AI accelerators with advanced DFT and silicon bring-up
Optimize AI accelerators with efficient design and test methodologies. Explore strategies for streamlining DFT and silicon ...
Baya Systems raises $36M for AI and chiplet innovation
Baya Systems, a chip technology company that wants accelerate intelligent computing, raised $36 million in funding.
Baya Systems Raises $36M+ to Propel AI and Chiplet Innovation
Baya Systems, a leader in system IP technology that empowers the acceleration of intelligent compute, today announced it has raised $36+ million in a Series B round led by Maverick Silicon, backed by ...
Wolfspeed Launches New Gen 4 MOSFET Technology Platform to Deliver Breakthrough Performance in Real-World Conditions for High-Power Applications
NYSE:WOLF) Wolfspeed Launches New Gen 4 MOSFET Technology Platform to Deliver Breakthrough Performance in Real-World Conditions for High-Power Applications ...