Optimization can potentially increase memory inside the chip package by up to 33%, reduce interface power by 70% and increase the available silicon real estate for logic functions by close to 25% ...
ANSYS’ Youngsoo Lee contends that chip-package-system co-design helps produce more cost-effective and reliable chips, in 7nm Design Success Necessitates A Multi-Physics Approach. Mentor Graphics’ ...
JAKARTA :Indonesia's unaudited budget deficit for 2024 was smaller than the government's earlier estimate, official data showed on Monday, providing a buffer for fiscal needs in 2025 after ...
Micron was the biggest gainer among semiconductor stocks with a 10.6 per cent rise, while chip-making equipment companies like Applied Materials, Lam Research and KLA Corp rose between 5.1 per ...
As such, the result is a chip that’s flat to the PCB like an SMD component, but with leads that extend much farther out than any traditional package. Obviously, the body of a DIP chip is still ...
HONG KONG--China is working on a more than 1 trillion yuan ($143 billion) support package for its semiconductor industry, three sources said, in a major step towards self-sufficiency in chips and ...
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This methodology, called SWAN, generates a simulation model for the complete digital part, which comprises the package as well as a combination ... a substrate simulation model for the entire chip is ...
Seoul, Korea – March 26 th, 2018-- Chips&Media, Inc. a leading video IP company headquartered in Seoul, Korea, was reportedly signed a contract with one of major SoC manufacturer in Asia to license ...
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