Design-Reuse1h
EXTOLL collaborates with BeammWave and GlobalFoundries as a Key SerDes IP Partner for Lowest Power High-Speed ASIC
EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by BeammWave, an innovation leader in mmWave 5G/6G digital beamforming, as a key SerDes ...
Design-Reuse2h
Baya Systems Welcomes Manish Muthal and Siva Yerramilli to Board of Directors
Industry leaders join team of experts including Jim Keller, Sailesh Kumar and Stan Reiss to propel innovation in the new era of high-performance system-of-chiplets design ...
Design-Reuse2h
Celestial AI Announces Appointment of Semiconductor Industry Icon Lip-Bu Tan to Board of Directors
Celestial AI™, creator of the Photonic Fabric™ optical interconnect technology platform, today announced the appointment of Lip-Bu Tan to the Board of Directors.
Design-Reuse2h
intoPIX and EvertzAV Strengthen IPMX AV-over-IP Interoperability with Groundbreaking JPEG XS TDC Compression Capabilities at ISE 2025
PIX, the leader in innovative image processing and compression technologies, is proud to announce the integration of its ...
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Quadric Opens Subsidiary in Japan with Industry Veteran Jan Goodsell as President
Quadric today announced that it is establishing a subsidiary, Quadric KK, in Tokyo, Japan, with industry veteran Jan Goodsell as President.
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Ceva, Inc. Appoints Amir Faintuch to its Board of Directors
Ceva today announced the appointment of Amir Faintuch, a seasoned technology executive, to its Board of Directors as an ...
Design-Reuse8h
Codasip and RED Semiconductor Sign Memorandum of Understanding to Develop AI Acceleration Technologies
Codasip GmbH and RED Semiconductor International Ltd have signed a Memorandum of Understanding (MoU) to collaborate on developing advanced AI acceleration technologies.