The global political and economic landscape is characterized by volatility; nevertheless, sources within the semiconductor ...

will transition from CowoS-S to CoWoS-L advanced packaging technology. That also shows how TSMC’s advanced packaging technology—chip on wafer on substrate (CoWoS)—is evolving to overcome interconnect ...

TSMC is on track to qualify its ultra-large version of chip-on-wafer-on-substrate (CoWoS) packaging technology that will offer an interposer size of up to nine reticle sizes and 12 HBM4 memory ...

TSMC's CoWoS capacity expansion is expected to double again in 2025; commentary on plant progress would be a key focus point in Q4 FY24's earnings call. The next couple of quarters may see further ...

TL;DR: NVIDIA is shifting from CoWoS-S to CoWoS-L advanced packaging for its Blackwell AI GPUs, requiring increased capacity from TSMC, the leader in semiconductor technology. This transition aims ...

When Amkor announced plans to build a $1.6 billion chip test and packaging facility near Peoria, Arizona, it was clear that the company planned to serve TSMC’s customers in the state. Apple is ...

CoWoS stands for chip wafer on a substrate. The CoWos-S is designed to meet the rigorous requirements of artificial intelligence chips. TSMC produces these for Nvidia and AMD (AMD). However ...

The revised road plan presents ... sees the drop in CoWoS-S capacity as a purposeful change rather than a reaction to diminishing demand, the study said. The earnings call by TSMC on January ...

CoWoS-S, to combine its AI chips. Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said ...