Tech mogul Bryan Johnson suggested Sunday to The Free Press’ Bari Weiss there are ways to “radically extend life beyond our ...

Many of will have marveled at the feats of reverse engineering achieved by decapping integrated circuits and decoding their secrets by examining the raw silicon die. Few of us will have a go for ...

Photon IP, a startup company in The Netherlands looking to improve the performance of photonic chips by closer integration of silicon and non-silicon semiconductor materials, says it has closed a ...

In a conventional system deploying real wires on a single silicon die items 2, 3 & 4 are not usually considered an issue. Delay (latency) even for a single wire or set of wires transversing much of ...

IP can be packaged in different ways, including soft IP (software), hard IP (physical layout), and even as “chiplets,” individual silicon die that deliver the IP function. The revenue, according to ...

rather useless. The CCD and SRAM silicon layers measure 7.2µm and 6µm respectively, with the total die stack and interconnects, etc measuring only 40-45µm. The total CCD is around 800µm thick ...