CoinDesk8h
The Protocol: Can Based Rollups Solve Ethereum’s Layer-2 Problem?
In recent years, Ethereum has embraced a layer-2 scaling roadmap—a plan that encouraged the development of third-party ...
Semiconductor Engineering14h
Simulation Study Of Vertically Stacked 2D NSFETs
A new technical paper titled “Simulation of Vertically Stacked 2-D Nanosheet FETs” was published by researchers at Università di Pisa and TU Wien. Abstract “We present a simulation study of vertically ...
Semiconductor Engineering14h
Rowhammer Mitigation With Adaptive Refresh Management Optimization (KAIST, Sk hynix)
ARFM-Driven Row Hammer Defense with Unveiling the Threat of Short tRC Patterns” was published by researchers at KAIST and Sk hynix. Abstract (partial) “To address the issue of powerful row hammer (RH) ...
techxplore14h
Holograms boost 3D printing efficiency and resolution
While traditional 3D printers work by depositing layers of material, tomographic volumetric additive manufacturing (TVAM) ...
Interesting Engineering19h
US engineers 3D-print tiny coin-sized engines to steer small satellites in space
This 3D printing technology could allow astronauts to manufacture satellite engines in space, eliminating the need for Earth-based launches.