Admittedly it’s a bit of a niche application, but if you need lots of flat 3D ... stack and separate them somehow. An old(er) solution is to use a non-extruding “ironing” step between each ...
This technology enable building circuits in 3 dimensional (3D) structures by stacking the wafers or dies in several layers using TSV for inter tier connection, as oppose to traditional 3D stacking ...
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Chinese chipmaker ships record-breaking chips: YMTC quietly begins shipping 5th Gen 3D TLC NANDY angtze Memory Technologies Co. (YMTC) has quietly started to ship its 5th-Gen 3D NAND memory with 294 layers in total as ...
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New 3D integrated metal-oxide transistors to fabricate compact and high density electronicsResearchers at King Abdullah University of Science and Technology (KAUST) have recently developed new three-dimensional (3D) ...
Yangtze Memory Technologies Co. (YMTC) has pushed forward with a 3D NAND chip that includes 294 total layers, out of which ...
Yangtze Memory Technologies Co. (YMTC) has quietly started to ship its 5th-Gen 3D NAND memory with 294 layers in total as well as 232 active layers, and analysts from TechInsights have managed to ...
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