AMD investors will closely examine the chip designer's artificial intelligence strategy when it reports fourth-quarter ...

Despite integration challenges, third-party chiplets offer cost savings and flexibility. Intel and AMD are optimizing performance with advanced interconnects, PHYs, and 3D stacking. Semiconductor ...

while Sugon's Hygon C86-7490 comes in AMD's most recent SP5 packaging for data center-grade processors, it does not ...

Fast forward nearly four years today, a new report from Tom's Hardware suggests that AMD is so impressed by the effectiveness of the approach that it is using "dual-chiplets" to design its ...

The new console may leverage AMD's "Halo" tech to stack cache RAM chiplets on both the CPU and GPU. Although the specific packaging method has not yet been disclosed, stacked cache technology ...