Leo Says 26 More accurately, Leo is confused and is asking questions. 01:01 What is overclocking in 2018? 06:27 Intel ‘9th Gen’ and Z390 due in October 07:49 AMD has come up with a scheme to produce ...

Accelerating multi-die, multi-chip SoC designs The Cadence® 112Gbps Extra Short Reach (XSR) SerDes IP for TSMC 7nm consists of eight lanes operating at 112Gigabit per second using PAM4 modulation.

For one, the A100 contains more than 54 billion transistors on a 826 mm2 die, making what it said is the largest 7nm processor. This is made possible by to the Ampere architecture’s use of the ...

UCIe enables chiplet industry standard interoperability combined with ultra-low latency, extreme power efficiency, and high performance bandwidth for die-to-die link interconnectivity The Cadence® ...